Thermal Science - scientific journal [keyword: three-dimensional integrated circuits]

THERMAL SCIENCE

International Scientific Journal

Thermal Science Journal [keyword: three-dimensional integrated circuits]

Papers published in THERMAL SCIENCE also containing keyword three-dimensional integrated circuits

Thermal optimization of the 3-D integrated circuits with fractal micro-channels

THERMAL SCIENCE, volume 30, No. 3, YEAR 2026

three-dimensional integrated circuits, Fractal microchannels, thermal optimization

A novel heat dissipation structure with embedded both through silicon vias and micro-channels for improving heat transfer performance of 3-D integrated circuits

THERMAL SCIENCE, volume 29, No. 2, YEAR 2025

three-dimensional integrated circuits, heat dissipation structure, heat transfer performance

Thermal modeling and analysis of 3-D integrated circuits with irregular structure

THERMAL SCIENCE, volume 27, No. 5, YEAR 2023

three-dimensional integrated circuits, irregular structure, numerical simulation, through-silicon via, equivalent thermal conductivity model, Maximum Temperature

Thermal model for 3-D integrated circuits with integrated MLGNR-based through silicon via

THERMAL SCIENCE, volume 24, No. 3, YEAR 2020

Thermal model, three-dimensional integrated circuits, MLGNR-based TSV