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THERMAL SCIENCE
International Scientific Journal
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A NOVEL HEAT DISSIPATION STRUCTURE WITH EMBEDDED BOTH THROUGH SILICON VIAS AND MICRO-CHANNELS FOR IMPROVING HEAT TRANSFER PERFORMANCE OF 3-D INTEGRATED CIRCUITS
ABSTRACT
This paper proposed a new heat dissipation structure with embedded both through silicon vias (TSV) and micro-channels to solve the complex heat problems of 3-D integrated circuits (3-D-IC). The COMSOL simulation model is established to investigate the characteristIC of steady-state response for the defined four cases. The simulation results show that our proposed heat dissipation structure (i.e., Case 4: 3-D-IC with embedded both TSV and micro-channels) can reduce steady-state temperature over 43.546%, 18.440%, and 12.338% in comparison Case 1 (i.e., 3-D-IC without embedded heat dissipation structure), Case 2 (i.e., 3-D-IC with only inserted TSV), and Case 3 (i.e., 3-D-IC with only embedded micro-channels), respectively. Besides, it is demonstrated that CNT as filler material of TSV and CNT nanofluid as coolant of micro-channels (i.e., the proposed Scheme 4) can further reduce steady-state temperature of 3D-IC with embedded our proposed heat dissipation structure. The corresponding results illustrated that the steady-state temperature of Scheme 4 is reduced by 13.767% as compared with Scheme 1 (i.e., the conventional Cu as filler material of TSV and water as coolant of micro-channels). Moreover, it is manifested that the heat transfer performance of 3-D-IC with embedded the proposed heat dissipation structure can be enhanced by the increase of TSV radius and flow rate of coolant of micro-channels. Therefore, our proposed heat dissipation structure has great prospect for enhancing heat transfer performance of 3-D-IC.
KEYWORDS
PAPER SUBMITTED: 2024-06-10
PAPER REVISED: 2024-07-30
PAPER ACCEPTED: 2024-08-12
PUBLISHED ONLINE: 2024-08-31
DOI REFERENCE: https://doi.org/10.2298/TSCI240610202X
CITATION EXPORT: view in browser or download as text file
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© 2026 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence