Thermal Science - scientific journal [keyword: through-silicon via]

THERMAL SCIENCE

International Scientific Journal

Thermal Science Journal [keyword: through-silicon via]

Papers published in THERMAL SCIENCE also containing keyword through-silicon via

Thermal modeling and analysis of 3-D integrated circuits with irregular structure

THERMAL SCIENCE, volume 27, No. 5, YEAR 2023

three-dimensional integrated circuits, irregular structure, numerical simulation, through-silicon via, equivalent thermal conductivity model, Maximum Temperature