Thermal Science

International Scientific Journal

Thermal Science Journal [Kang-Jia Wang]

name

Kang-Jia Wang

institution

School of Physics and Electronic Information Engineering, Henan Polytechnic University

address

Jiaozuo, China

papers by Kang-Jia Wang published in Thermal Science

Solitary wave and singular wave solutions to the new (2+1)-D shallow water wave equation

THERMAL SCIENCE, volume 29, No. 2, YEAR 2025

this paper authors:

Zhen Zhang

Kai Zhang

Kang-Jia Wang

On the periodic wave solutions of the (2+1)-D Konopelchenko-Dubrovsky equation in fluid mechanics

THERMAL SCIENCE, volume 29, No. 2, YEAR 2025

this paper authors:

Zhen Zhang

Kang-Jia Wang

Kai Zhang

On a fractal RLC-parallel resonant circuit modeled within the local fractional derivative

THERMAL SCIENCE, volume 28, No. 4, YEAR 2024

this paper authors:

Yu Tian

Wen-Bo Geng

Shao-Hui Wang

Kang-Jia Wang

New exact solutions of the local fractional (3+1)-dimensional Kadomstev-Petviashvili equation

THERMAL SCIENCE, volume 28, No. 4, YEAR 2024

this paper authors:

Chuan Du

Kang-Jia Wang

Jin-Fei Guo

Yi-Chen Bai

Dynamic behaviors of the non-linear local fractional heat conduction equation on the cantor sets

THERMAL SCIENCE, volume 28, No. 4, YEAR 2024

this paper authors:

Geng Li

Kang-Jia Wang

An equivalent thermal conductivity model of through silicon via arrays for thermal analysis in 3-D integrated circuits

THERMAL SCIENCE, volume 28, No. 5, YEAR 2024

this paper authors:

Zhao-Pei Xu

Kang-Jia Wang

Non-differentiable exact solutions of the local fractional Klein-Fock-Gordon equation on cantor sets

THERMAL SCIENCE, volume 27, No. 2, YEAR 2023

this paper authors:

Jun Cheng

Jian Sheng Yu

Kang-Jia Wang

Variational approach for the fractional exothermic reactions model with constant heat source in porous medium

THERMAL SCIENCE, volume 27, No. 4, YEAR 2023

this paper authors:

Kang-Jia Wang

A new fractal model of the convective-radiative fins with temperature-dependent thermal conductivity

THERMAL SCIENCE, volume 27, No. 4, YEAR 2023

this paper authors:

Kang-Jia Wang

Feng Shi

An analytical thermal model for the 3-D integrated circuit with new-type through silicon via

THERMAL SCIENCE, volume 27, No. 3, YEAR 2023

this paper authors:

Zhao-Pei Xu

Kang-Jia Wang

Taylor series solution for the non-linear Emden-Fowler equations

THERMAL SCIENCE, volume 26, No. 3, YEAR 2022

this paper authors:

Yan-Hong Liang

Kang-Jia Wang

A new fractional thermal model for the Cu/Low-k interconnects in nanometer integrated circuit

THERMAL SCIENCE, volume 26, No. 3, YEAR 2022

this paper authors:

Pei-Ling Zhang

Kang-Jia Wang

A new RLC series-resonant circuit modeled by local fractional derivative

THERMAL SCIENCE, volume 25, No. 6, YEAR 2021

this paper authors:

Mei Dong

Cui-Ling Li

Wu-Fa Chen

Guo-Qian Li

Kang-Jia Wang

Thermal management of 3-D integrated circuits with special structures

THERMAL SCIENCE, volume 25, No. 3, YEAR 2021

this paper authors:

Kang-Jia Wang

Cui-Ling Li

A new fractal viscoelastic element: Promise and applications to Maxwell-rheological model

THERMAL SCIENCE, volume 25, No. 2, YEAR 2021

this paper authors:

Yan-Hong Liang

Kang-Jia Wang

Optimization of a 3-D high-power LED lamp: Orthogonal experiment method and experimental verification

THERMAL SCIENCE, volume 25, No. 2, YEAR 2021

this paper authors:

Chu-Xia Hua

Kang-Jia Wang

Thermal optimization of a 3-D integrated circuit

THERMAL SCIENCE, volume 24, No. 4, YEAR 2020

this paper authors:

Kang-Jia Wang

Chu-Xia Hua

Yan-Hong Liang

Thermal management of the through silicon vias in 3-D integrated circuits

THERMAL SCIENCE, volume 23, No. 4, YEAR 2019

this paper authors:

Kang-Jia Wang

Chu-Xia Hua

Hong-Chang Sun

A modification of the reduced differential transform method for fractional calculus

THERMAL SCIENCE, volume 22, No. 4, YEAR 2018

this paper authors:

Kang-Le Wang

Kang-Jia Wang

Thermal management of the hotspots in 3-D integrated circuits

THERMAL SCIENCE, volume 22, No. 4, YEAR 2018

this paper authors:

Kang-Jia Wang

Hong-Chang Sun

Cui-Ling Li

Guo-Dong Wang

Hong-Wei Zhu

An analytical thermal model for three-dimensional integrated circuits with integrated micro-channel cooling

THERMAL SCIENCE, volume 21, No. 4, YEAR 2017

this paper authors:

Kang-Jia Wang

Hong-Chang Sun

Zhong-Liang Pan

Integrated microchannel cooling in a three dimensional integrated circuit: A thermal management

THERMAL SCIENCE, volume 20, No. 3, YEAR 2016

this paper authors: