THERMAL SCIENCE

International Scientific Journal

Pei-Ling Zhang

,

Kang-Jia WangORCID

A NEW FRACTIONAL THERMAL MODEL FOR THE CU/LOW-K INTERCONNECTS IN NANOMETER INTEGRATED CIRCUIT

ABSTRACT
In this paper, the Cu/Low-k interconnects in a nanoscale integrated circuit are considered. A new fractal conventional heat transfer equation is suggested using He's fractal derivative. The two-scale transform method is applied for solving the equation approximately. The new findings, which the traditional differential models can never reveal, shed a bright light on the optimal design of a nanoscale integrated circuit.
KEYWORDS
He’s fractal derivative, fractional thermal model, interconnects, Two-scale transform method
PAPER SUBMITTED: 2020-06-08
PAPER REVISED: 2021-10-01
PAPER ACCEPTED: 2021-10-01
PUBLISHED ONLINE: 2022-07-16
DOI REFERENCE: https://doi.org/10.2298/TSCI2203413Z
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2022, VOLUME 26, ISSUE No. 3, PAGES [2413 - 2418]
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A new fractional thermal model for the Cu/Low-k interconnects in nanometer integrated circuit

© 2026 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence