THERMAL SCIENCE

International Scientific Journal

Kang-Jia WangORCID

,

Chu-Xia Hua

,

Hong-Chang Sun

THERMAL MANAGEMENT OF THE THROUGH SILICON VIAS IN 3-D INTEGRATED CIRCUITS

ABSTRACT
The through silicon via technology is a promising and preferred way to realize the reliable interconnection for 3-D integrated circuit integration. However, its size and the property of the filled-materials are two factors affecting the thermal behavior of the integrated circuits. In this paper, we design 3-D integrated circuits with different through silicon via models and analyze the effect of different material-filled through silicon vias, aspect ratio and thermal conductivity of the dielectric on the steady-state temperature profiles. The results presented in this paper are expected to aid in the development of thermal design guidelines for through silicon vias in 3-D integrated circuits.
KEYWORDS
thermal, through silicon via, 3-D integrated circuit, nanoscale flow
PAPER SUBMITTED: 2018-02-20
PAPER REVISED: 2018-11-25
PAPER ACCEPTED: 2018-11-26
PUBLISHED ONLINE: 2019-09-14
DOI REFERENCE: https://doi.org/10.2298/TSCI1904157W
CITATION EXPORT: view in browser or download as text file
THERMAL SCIENCE YEAR 2019, VOLUME 23, ISSUE No. 4, PAGES [2157 - 2162]
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Thermal management of the through silicon vias in 3-D integrated circuits

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