Thermal Science - scientific journal [author: Chun Shan]

THERMAL SCIENCE

International Scientific Journal

Thermal Science Journal [Chun Shan]

name

Chun Shan

institution

School of Electronics and Information, Guangdong Polytechnic Normal University

address

Guangzhou, China

papers by Chun Shan published in Thermal Science

A novel heat dissipation structure with embedded both through silicon vias and micro-channels for improving heat transfer performance of 3-D integrated circuits

THERMAL SCIENCE, volume 29, No. 2, YEAR 2025

this paper authors:

Peng Xu

,

Huan Huang

,

Fa Zou

,

Chun Shan

The adoption of novel cooling liquids for enhancing heat transfer performance of 3-D integrated circuits with embedded micro-channel

THERMAL SCIENCE, volume 29, No. 1, YEAR 2025

this paper authors:

Huan Huang

,

Chun Shan

,

Futang Long

,

Zongjie Zeng

,

Lei Xie

,

Fa Zou

,

Peng Xu