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THE ADOPTION OF NOVEL COOLING LIQUIDS FOR ENHANCING HEAT TRANSFER PERFORMANCE OF 3-D INTEGRATED CIRCUITS WITH EMBEDDED MICRO-CHANNEL
ABSTRACT
The nanofluids (including MWCNT based nanofluid and SWCNT based nanofluid) and liquid metal Ga68In20Sn12 are proposed to replace the conventional water as cooling liquid of micro-channel for enhancing heat transfer performance of 3-D integrated circuits (3-D IC) in this paper. An equivalent thermal model of 3-D IC with integrated micro-channel is established to investigate the heat transfer performances for using different cooling liquids. The results show that the steady-state temperature for MWCNT based nanofluid, SWCNT based nanofluid and Ga68In20Sn12 as cooling liquids can be reduced over 25.698%, 28.771%, and 35.735% than the conventional water scheme in a four-layers stacked chip, respectively. Besides, it is found that the steady-state temperature of all die layer in 3-D IC can be further reduced by increasing the micro-channel size and flow velocity of cooling liquid. Therefore, the proposed novel materials (i.e., nanofluids and Ga68In20Sn12) as cooling liquids have excellent application prospect in solving thermal problems of 3-D IC.
KEYWORDS
PAPER SUBMITTED: 2024-04-14
PAPER REVISED: 2024-05-20
PAPER ACCEPTED: 2024-05-26
PUBLISHED ONLINE: 2024-08-18
DOI REFERENCE: https://doi.org/10.2298/TSCI240414175H
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© 2026 Society of Thermal Engineers of Serbia. Published by the Vinča Institute of Nuclear Sciences, National Institute of the Republic of Serbia, Belgrade, Serbia. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution-NonCommercial-NoDerivs 4.0 International licence


