Thermal Science - scientific journal [author: Lihang Yu]

THERMAL SCIENCE

International Scientific Journal

Thermal Science Journal [Lihang Yu]

name

Lihang Yu

institution

Institute of Microelectronics of the Chinese Academy of Science

address

Beijing, China

papers by Lihang Yu published in Thermal Science

Investigation on the unconstrained microfluidic heat sink with high anti-blockage capacity for multiple hotspots system

THERMAL SCIENCE, volume 28, No. 2, YEAR 2024

this paper authors:

Lihang Yu

,

Yuxin Ye

,

Zhenyu Wang

,

Ruiwen Liu

,

Xiangbin Du

,

Yanmei Kong

,

Shichang Yun

,

Jie Wang

,

Yulin Shi

,

Binbin Jiao

Investigation on the heat dissipation of high heat flux chip array by fractal microchannel networks

THERMAL SCIENCE, volume 27, No. 1, YEAR 2023

this paper authors:

Bo Cong

,

Ruiwen Liu

,

Yuxin Ye

,

Xiangbin Du

,

Lihang Yu

,

Nan Zhang

,

Shiqi Jia

,

Yanmei Kong

,

Binbin Jiao

Experimental investigation of the embedded micro-channel manifold cooling for power chips

THERMAL SCIENCE, volume 26, No. 2, YEAR 2022

this paper authors:

Nan Zhang

,

Ruiwen Liu

,

Yanmei Kong

,

Yuxin Ye

,

Xiangbin Du

,

Bo Cong

,

Lihang Yu

,

Zhiqiang Wang

,

Yang Dai

,

Wei Li

,

Binbin Jiao

,

Zhiyong Duan