THERMAL SCIENCE

International Scientific Journal

Thermal Science Journal [Bo Cong]

name
Bo Cong
institution
Institute of Microelectronics of the Chinese Academy of Science
address
Beijing, China
papers by Bo Cong published in Thermal Science
THERMAL SCIENCE, volume 27, No. 1, YEAR 2023
this paper authors:

Bo Cong

,

Ruiwen Liu

,

Yuxin YeORCID

,

Xiangbin DuORCID

,

Lihang Yu

,

Nan ZhangORCID

,

Shiqi JiaORCID

,

Yanmei Kong

,

Binbin JiaoORCID

THERMAL SCIENCE, volume 26, No. 2, YEAR 2022
this paper authors:

Nan ZhangORCID

,

Ruiwen Liu

,

Yanmei Kong

,

Yuxin YeORCID

,

Xiangbin DuORCID

,

Bo Cong

,

Lihang Yu

,

Zhiqiang WangORCID

,

Yang DaiORCID

,

Wei LiORCID

,

Binbin JiaoORCID

,

Zhiyong DuanORCID