Thermal Science - scientific journal [keyword: thermal through silicon via]

THERMAL SCIENCE

International Scientific Journal

Thermal Science Journal [keyword: thermal through silicon via]

Papers published in THERMAL SCIENCE also containing keyword thermal through silicon via

Optimized method for thermal through silicon via placement with non-uniform heat sources in 3-D-IC

THERMAL SCIENCE, volume 27, No. 5, YEAR 2023

three-dimensional integrated circuit, non-uniform, optimized method, cost function, thermal through silicon via