THERMAL SCIENCE

International Scientific Journal

Thermal Science Journal [Dan Wang]

name
Dan Wang
institution
Institute of Applied Electronics, China Academy of Engineering Physics
address
Mianyang, China
papers by Dan Wang published in Thermal Science
THERMAL SCIENCE, volume 27, No. 6, YEAR 2023
this paper authors:

Liu Liu

,

Yu-Shi Wen

,

Dan Wang

,

Hong Yang

,

Xiao-Gan Dai

,

Chang-Gen Feng

,

Qiang Gan

,

Yang Zhou