THERMAL SCIENCE
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THERMAL SCIENCE
International Scientific Journal
Thermal Science Journal [Bin Wu]
name
Bin Wu
institution
Chongqing Huayu Group Co., Ltd.,Chongqing
address
Ltd.,Chongqing, China
ORCID
0009-0009-1892-6446
papers by Bin Wu published in Thermal Science
Development of a new silicate thermal insulation coating and analysis of heat storage characteristics
THERMAL SCIENCE, volume 27, No. 2, YEAR 2023
this paper authors:
Chenghui Wei
,
Hao Chen
,
Bin Wu