THERMAL SCIENCE

International Scientific Journal

Thermal Science Journal [Zhengchu Yang]

Zhengchu Yang

Zhengchu Yang1

,

Shoujun Sun2

,

Dechang Wang1

,

Qinglu Song1,3

1 College of Mechanical and Electrical Engineering, Qingdao University, Qingdao, China
2 National Engineering Research Center of Digital Home Networking, Qingdao, China
3 School of Energy and Environment, City University of Hong Kong, Hong Kong, Hong Kong
Research on cooling high-power multi-core processors: Based on a hybrid microchannel multiple array pin fin heat sink
THERMAL SCIENCE, volume 30, No. 4, YEAR 2026